Method of selective etching native oxide

Fishing – trapping – and vermin destroying

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437239, 437243, 437946, 148DIG17, 148DIG51, 156646, 156654, 156662, H01L 2102

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052945685

ABSTRACT:
A method of selective etching of native oxide on a substrate is disclosed in which hydrogen halide vapor and water vapor are exposed to the substrate surface under appropriate conditions and long enough to remove native oxide but not long enough to remove any significant amount of other oxides. Treating conditions are maintained to prevent water vapor from condensing on the substrate until sufficient native oxide is etched so that substantially all the native oxide will be etched before appreciable other oxides are etched.

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patent: 4749440 (1988-06-01), Blackwood et al.
patent: 4885056 (1989-12-01), Hall et al.
Miki et al., "Gas-phase selective etching of native oxide"; IEEE Transaction on Elec. Devices, vol. 37, No. 1, Jan. 1990, pp. 107-115.
Novak; "Anhydrous HF etching of native SiO.sub.2 : Application to Device Fabrication"; Solid State Tech; Mar. 1988; pp. 39-41.
P. A. M. van der Heide; "Etching of thin SiO.sub.2 layers using wet HF gas"; J. Vac. Sci. Technol A 7(3); May/Jun. 1989; pp. 1719-1723.
Weston; "HF vapor phase etching (HF/VPE): production viability for semi-manufacturing and reaction model"; J. Vac. Sci. Tech., 17(1) Jan./Feb. 1980 pp. 466-469.
Bersin, "The DryOx process for etching Silicon Dioxide"; Solid State Tech. Apr. 1977; pp. 78-80.
Jun-Ru; "A new conformal dry-etch technique for submicrometer structures"; J. Vac. Sci. Tech. 19(4), Nov./Dec. 1981, pp. 1385-1389.
Beyer, "Silicon Surface Cleaning Process"; IBM Tech. Dis. Bulletin vol. 20, No. 5, Oct. 1977; pp. 1746-1747.
Beyer, "Removal of native oxide layer on a semiconductor surface"; IBM Tech. Dis. Bulletin; vol. 22, No. 7, Dec. 1979; p. 2839.

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