Method of selective bonding of textile materials

Details Method of selective bonding of textile materials Method of selective bonding of textile materials

1982-12-20

1984-10-02

Van Balen, William J.

Stock material or miscellaneous articles

Sheet including cover or casing

Foamed or expanded material encased

428 76, 428157, 428158, 428177, 428190, 428192, 4283044, B32B 104, B32B 300, B32B 310

Patent

active

044748400

ABSTRACT:
A cushioned panel is provided together with a process of molding it. A non-woven fabric having an outer layer composed of polypropylene or other thermoplastic fibers is heated to the melting point of the fibers. It is inserted into a mold having a decorative surface fabric and a piece of foam cushioning therein. The mold is designed so that the edges of the male and female mold halves compress the molten non-woven substrate and the surface fabric forcing the molten surface of the substrate into the interstices of the surface fabric. A mechanical bond is formed upon cooling.

REFERENCES:
patent: 2797179 (1957-06-01), Reynolds et al.
patent: 2853399 (1958-09-01), Shoults
patent: 3164655 (1965-01-01), Howard et al.
patent: 3301257 (1967-01-01), Crowe, Jr. et al.
patent: 3562052 (1971-02-01), Mertejcek et al.
patent: 3647588 (1972-03-01), Greig
patent: 3713936 (1973-01-01), Ramsey
patent: 4186235 (1980-01-01), Bramwell
patent: 4199635 (1980-04-01), Parker
patent: 4262051 (1981-04-01), Welz et al.
patent: 4338366 (1982-07-01), Evans et al.
patent: 4377609 (1983-03-01), Bartoli et al.
patent: 4411944 (1983-10-01), Moore

Affiliated with

Also associated with

Rating

Method of selective bonding of textile materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of selective bonding of textile materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of selective bonding of textile materials will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-526853