Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1983-08-22
1984-09-11
Roy, Upendra
Metal working
Method of mechanical manufacture
Assembling or joining
148175, 148 15, 156612, 357 91, H01L 21203, C23C 1308
Patent
active
044701926
ABSTRACT:
A method is provided for selectively doping a compound semiconductor such as GaAs in situ by molecular beam epitaxy. The surface of the GaAs is coated with a thin layer of As by exposing it to an arsenic flux within a molecular beam epitaxy chamber. Selected areas of the surface are irradiated with a laser beam or a beam of photons, electrons, or ions in order to desorb As and form a mask of As on the surface. Dopant material such as tin is then deposited over the surface and As mask. The semiconductor is then heated to desorb the As mask while leaving the dopant in the unmasked areas. An epitaxial layer of GaAs is then grown over the surface by molecular beam epitaxy.
REFERENCES:
patent: 4071383 (1978-01-01), Nagata et al.
patent: 4086108 (1978-04-01), Gonda
patent: 4242149 (1980-12-01), King et al.
patent: 4261771 (1981-04-01), Dingle et al.
patent: 4312681 (1982-01-01), Rupprecht et al.
patent: 4383872 (1983-05-01), Roberts
patent: 4392453 (1983-07-01), Luscher
Neave et al., Jour. Crystal Growth, 44 (1978) 387.
Hammann H. Fredrick
Malin Craig O.
Rockwell International Corporation
Roy Upendra
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