Method of segmenting a wafer

Details Method of segmenting a wafer Method of segmenting a wafer

2007-11-20

2007-11-20

Nguyen, Thanh (Department: 2813)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S458000, C438S464000, C257S023000

Reexamination Certificate

active

11160975

ABSTRACT:
First, a device wafer having a substrate layer and a device layer is provided. Then, a first mask pattern is utilized to remove the device layer uncovered by the first mask pattern. Subsequently, a medium layer is formed on the surface of the device wafer, and the medium layer is then bonded to a carrier wafer. Thereafter, a second mask pattern is utilized to remove the substrate layer uncovered by the second mask pattern. Finally, the medium layer is separated from the carrier wafer, the substrate layer is bonded to an extendable film, and the medium layer is then removed.

REFERENCES:
patent: 7041577 (2006-05-01), Rayssac et al.
patent: 7118990 (2006-10-01), Xu et al.
patent: 2002/0123210 (2002-09-01), Liu
patent: 2006/0030130 (2006-02-01), Shao et al.

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