Metal working – Method of mechanical manufacture – Electrical device making
Patent
1991-09-09
1993-06-22
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29832, 206228, 252511, 252514, H05K 334
Patent
active
052207242
ABSTRACT:
A method for mounting Surface-Mounted-Devices ("SMD's") on a substrate, e.g. a PC board, involves warming an adhesive containing conductive particles from a room-temperature solid state to a warmed fluid state, applying said fluid adhesive to the substrate, permitting the adhesive to cool back into a solid state, subsequently warming the substrate and adhesive to render the adhesive tacky and yielding, mounting the components (2-5) in the tacky adhesive, and permitting the adhesive to cool back into a solid state, thereby securing the components on the substrate.
REFERENCES:
patent: 4208005 (1980-06-01), Nate et al.
patent: 4616413 (1986-10-01), Iliov et al.
patent: 4617729 (1986-10-01), Celnik
patent: 4654752 (1987-03-01), Kyle
patent: 4667401 (1987-05-01), Clements et al.
patent: 4694572 (1987-09-01), Leber et al.
patent: 4811081 (1989-03-01), Lyden
patent: 4820446 (1989-04-01), Prud'Homme
patent: 4856185 (1989-08-01), Baumgartner
patent: 4994207 (1991-02-01), Edelman et al.
patent: 5002818 (1991-03-01), Licari et al.
Derwent WPI Abstract of DE-OS 38 00 136.
Byron C. Sakiadis et al., DuPont Company, "Thermal Stress Reduction Via Thermoplastic Die-Attach Adhesive", in Microelectronic Manufacturing & Testing, Jun. 1988, pp. 9-10.
L. Ying, "A Reworkable High Reliability Thermoplastic Die Attach Adhesive", Proceedings of the 1986 International Symposium on Microelectronics, sponsored by the International Society for Hybrid Microelectronics, Reston Va., Oct. 1986.
Henkel Corporation, Adhesives & Industrial Resins Division, information sheet of Macromelt 6208 Thermoplastic polyamide adhesive (one page, undated).
Arbes Carl J.
Robert & Bosch GmbH
LandOfFree
Method of securing surface-mounted devices to a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of securing surface-mounted devices to a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of securing surface-mounted devices to a substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1434632