Method of securing semi-conductor wafer using retention clip

Details Method of securing semi-conductor wafer using retention clip Method of securing semi-conductor wafer using retention clip

1992-08-14

1993-10-19

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Work holding

292811, 269254R, 269155, 269157, 269265, B25B 100, B23Q 700

Patent

active

052534111

ABSTRACT:
A clip for removably securing a semi-conductor wafer to the treatment surface of a semi-conductor wafer processing pedestal. The clip is constructed with a pair of spaced apart, forwardly extending tines adapted to engage outer edges of a semi-conductor wafer supported upon the treatment surface. A clip tail is oppositely disposed from the tines and affords resilient movement of the tines toward and away from the edges of the pedestal treatment surface to enable the installation and removal of the wafer therefrom.

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patent: 5033709 (1991-07-01), Yueh
patent: 5040484 (1991-08-01), Mears et al.
patent: 5086371 (1992-02-01), Grammas et al.

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