Method of securing a semiconductor chip on a base plate and stru

Details Method of securing a semiconductor chip on a base plate and stru Method of securing a semiconductor chip on a base plate and stru

1997-01-29

1999-07-13

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438106, 438119, 438123, H01L 2144, H01L 2148, H01L 2150

Patent

active

059239565

ABSTRACT:
A semiconductor chip such as a cold cathode is mounted on a base plate using a conventional solder or like metallic eutectic material or conductive paste, and then secured to the base plate using an inorganic adhesive or like material, which is capable of being hardened at a temperature lower than the mounting temperature, and the bonding strength of which is not deteriorated even at higher temperatures.

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patent: 5194695 (1993-03-01), Maslakow
patent: 5211707 (1993-05-01), Ditchek et al.
patent: 5229331 (1993-07-01), Doan et al.
patent: 5338704 (1994-08-01), Imai et al.
patent: 5455196 (1995-10-01), Frazier
patent: 5585301 (1996-12-01), Lee et al.

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