Method of securely mounting conductive balls

Details Method of securely mounting conductive balls Method of securely mounting conductive balls

1997-07-02

2000-08-29

Ryan, Patrick

Metal fusion bonding

Process

Preplacing solid filler

228 41, 22818022, B23K 1018, B23K 100, B23K 3102

Patent

active

061095095

ABSTRACT:
A suction head sucks up conductive balls to its suction holes, and mounts them on pads of said workpiece. That is, the suction head is lowered so as to land the conductive balls onto the pads, and then is raised, and a positive pressure is applied in a space defined in the suction head and communicated with the suction holes and thereafter, the positive pressure is released so as to effect the atmospheric pressure in the space. As a result, the conductive balls are smoothly and surely separated from the suction holes and mounted onto the pads of the workpiece. Thereby it is possible to rapidly mount the conductive balls sucked at the lower surface of the suction head onto the pads of the workpiece.

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