Abrading – Abrading process – Combined abrading
Reexamination Certificate
2005-02-15
2005-02-15
Nguyen, George (Department: 3723)
Abrading
Abrading process
Combined abrading
C451S067000, C451S041000, C451S288000, C451S388000, C451S398000
Reexamination Certificate
active
06855037
ABSTRACT:
The present invention provides a wafer carrier that includes an opening, which in one embodiment is a plurality of holes, disposed along the periphery of the wafer carrier. A gas emitted through the holes onto a peripheral back edge of the wafer assists in preventing the processing liquids and contaminants resulting therefrom from reaching the inner region of the base and the backside inner region of the wafer. In another embodiment, a plurality of concentric sealing members are used to prove a better seal, and the outer seal is preferably independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier.
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International Search Report mailed Mar. 16, 2004, PCT/US03/17228.
Ashjaee Jalal
Basol Bulent
Talieh Homayoun
Volodarsky Konstantin
ASM-Nutool Inc.
Nguyen George
Pillsbury & Winthrop LLP
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