Method of sealing semiconductor device with resin by pressing a

Details Method of sealing semiconductor device with resin by pressing a Method of sealing semiconductor device with resin by pressing a

1990-05-17

1992-02-25

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437214, 437220, 437902, 357 81, H01L 2156, H01L 2158, H01L 2160, H01L 21603

Patent

active

050913417

ABSTRACT:
A method of sealing a semiconductor device with resin includes the steps of coupling the tie bar of a lead frame to a heat sink; die bonding a semiconductor chip to the surface of the heat sink; wire bonding and electrically connecting the semiconductor chip to leads of the lead frame; placing the heat sink on the bottom surface of a cavity of a lower mold, putting an upper mold on the lower mold, and pressing down the coupling portion between the heat sink and lead frame toward the bottom surface by using a pressure member mounted on the upper mold; and injecting melted resin within the cavity defined by the upper and lower molds, and hardening the resin.

REFERENCES:
patent: 3729573 (1973-04-01), Dunn
patent: 4377548 (1983-03-01), Pierpont
patent: 4470786 (1984-09-01), Sano et al.
patent: 4626185 (1986-12-01), Monnet
patent: 4823234 (1989-04-01), Konishi et al.
patent: 4954307 (1990-09-01), Yokohama
Nikkei Micro Devices, Nov., 1988, pp. 74-75, "News Probe".

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