Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1987-06-10
1989-07-18
Shoap, Allan N.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29841, 29855, 29856, 1562757, 156293, 264 25, 264260, 26427213, 277 1, 277227, B29C 3508, B32B 3128, H05K 300
Patent
active
048490482
ABSTRACT:
A method of sealing electric and electonic parts, comprising employing two different ultraviolet-curing resins for upper and lower layer portions, respectively, the resin employed for the upper layer portion having a smaller specific gravity than that of the resin for the lower layer portion before the resins are cured, and simultaneously curing the resins by irradiation with an ultraviolet ray. The ultraviolet-curing resin employed for the upper layer portion is an epoxy acrylate or epoxy resin, while an urethane acrylate ultraviolet-curing resin is employed for the lower layer portion, and the thickness of the ultraviolet-curing resin employed for the upper layer portion is set at from 0.5 mm to 3 mm.
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Inagaki Akio
Nakai Kiyotaka
Tauchi Hitoshi
Aisin Seiki Kabushiki Kaisha
Shoap Allan N.
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