Method of sealing a soldered joint between a semiconductor devic

Details Method of sealing a soldered joint between a semiconductor devic Method of sealing a soldered joint between a semiconductor devic

1995-06-06

1996-07-16

Dodson, Shelley A.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

524101, 528422, 528423, 257668, 257773, 257774, 257778, 257786, 257788, C08K 534, C08G 7306

Patent

active

055367658

ABSTRACT:
Triazine polymers obtained by reacting (a) monocyanate; and (b) dicyanate and/or prepolymers thereof are used in forming interconnection structures for bonding an integrated semiconductor device to a carrier substrate.

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