Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2000-01-19
2001-08-21
Mayes, Curtis (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S247000, C156S289000, C053S419000
Reexamination Certificate
active
06277227
ABSTRACT:
TECHNICAL FIELD
The present invention relates to packaging tape, and more particularly to packaging tape with an integral pull-tab.
BACKGROUND OF THE INVENTION
Adhesive packaging tape is typically used in packaging of boxes and cartons, and also in various manufacturing processes for securing or adhering components. The problem with this tape arises when attempting to re-open the closed package. When removing the tape from the package, it is often difficult to grip the tape for removal. Often, an operator must cut the tape with a knife or dig up a corner of the tape, each of which likely results in damage to the underlying package or carton.
It is desirable to provide a packaging tape designed in a manner in which it is easy to remove without loss of adherence characteristics and without damage to the underlying package.
DISCLOSURE OF INVENTION
The present invention overcomes the above referenced shortcomings of prior art packaging tape designs by providing packaging tape with a pull-tab formed continuously along the length of the tape to facilitate removal of the tape from a package. Ink is applied to the non-adhering portion for displaying tape removal instructions, and a coating is applied over the ink as a means for deadening the adhesive applied to the non-adhering portion.
More specifically, the present invention provides a packaging tape comprising a plastic film formed in a continuous length, and having first and second edges along the continuous length, and further having a first portion and a second portion continuously along the length adjacent the first and second edges, respectively. An adhesive is applied to both the first and second portions. Means for deadening the adhesive is applied to the first portion, whereby the first portion forms a continuous pull-tab along the length of the tape.
The present invention also provides a method of manufacturing packaging tape comprising the steps of: (i) providing a plastic film having a film width and formed in a continuous length with an adhesive on one side thereof, and having an edge continuously along the length; (ii) deadening a portion of the adhesive along said edge, whereby to form a non-adhering portion acting as a pull-tab continuously along the length of the tape to facilitate removal of the tape.
Accordingly, an object of the present invention is to provide a packaging tape which is easily removed from a package without the need for cutting the tape and with minimal risk of damaging the underlying package.
Another object of the present invention is to provide an improved packaging tape with a continuous pull-tab formed along the length of the tape to facilitate removal of the tape from the package.
The above objects, and other objects, features and advantages of the present invention are readily apparent from the following detailed description taken in connection with the accompanying figures.
REFERENCES:
patent: 3873018 (1975-03-01), Donnay
patent: 4869769 (1989-09-01), DiRusso, Jr. et al.
patent: 5153043 (1992-10-01), Wang
patent: 5340629 (1994-08-01), Rodighiero
patent: 5525390 (1996-06-01), Yang
patent: 5980676 (1999-11-01), Meetze
patent: 1 422 364 (1997-01-01), None
patent: 63-57687 (1988-03-01), None
patent: 96/05108 (1996-02-01), None
Jones Michael
Moulds Kristopher A.
Notaro Donald F.
Brooks & Kushman P.C.
JM Industries, Inc.
Mayes Curtis
LandOfFree
Method of sealing a package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of sealing a package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of sealing a package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2487403