Method of sealing a ceramic lid on a ceramic semiconductor packa

Details Method of sealing a ceramic lid on a ceramic semiconductor packa Method of sealing a ceramic lid on a ceramic semiconductor packa

1989-07-24

1990-04-03

Albritton, C. L.

Electric heating

Metal heating

By arc

21912176, 21912177, 21912178, B23K 2600

Patent

active

049142690

ABSTRACT:
A method of sealing a ceramic lid on a ceramic semiconductor package with a high-power laser beam. As an aid to package assembly prior to the fusion of the package lid to the package body, a lid recess is created around the die installation cavity of the package body. Following the installation of a die within a package cavity, the package body is retrieved from a process tray by a pick and place robot and placed in a position locating fixture. The same robot then retrieves a ceramic lid from an automatic lid dispensing unit, and places it within the lid recess of the package body. With the lid positioned within the recess, a Yttrium-Aluminum-Garnet (YAG) laser with beam splitter optics is moved by an X-Y table arm precisely over the top of the package. Moving with a linear speed of approximately 2.1 cm/sec. and with a power setting of approximately 170 watts, the split beam YAG laser simultaneously fuses a pair of opposite edges of the lid to the adjacent edges of the recess. A second pass with the split beam laser fuses the remaining pair of lid edges to the package body. Total process time for hermetically sealing the lid to the body is less than two seconds. Once the package is sealed, the robot retrieves the part and places it in an output queue.

REFERENCES:
patent: 3210171 (1965-10-01), MacDonald
patent: 3217088 (1965-11-01), Steierman
patent: 3517159 (1970-06-01), Milochevitch
patent: 4521668 (1985-06-01), Osial et al.

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