Method of screening semiconductor device

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S754120

Reexamination Certificate

active

07106084

ABSTRACT:
A method of screening a semiconductor device comprises the steps of successively forming a gate insulation film (102) and a conductive film (104) on a silicon wafer (100) to provide a structure (106) and bringing the first voltage application terminal (110) into contact with the back of the structure and the second voltage application terminal (112) having a potential different from that of the first voltage application terminal (110) into contact with the surface of the conductive film (104) to thereby apply a stress voltage to the structure (106).

REFERENCES:
patent: 4281449 (1981-08-01), Ports et al.
patent: 5519334 (1996-05-01), Dawson
patent: 6119255 (2000-09-01), Akram
patent: 6525555 (2003-02-01), Khandros et al.
patent: 6933527 (2005-08-01), Isobe et al.
patent: 6029301 (1994-02-01), None

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