Metal fusion bonding – Process – Plural joints
Patent
1980-12-01
1982-01-19
Beck, Shrive P.
Metal fusion bonding
Process
Plural joints
228248, 29840, 29843, B23K 112
Patent
active
043112676
ABSTRACT:
Paste solder is contact printed onto lead and component pads of a leaded hybrid substrate through holes that are arranged in a plate in the pattern of the pads, a first recess in the solder or top side of the plate extending over the area containing component holes. In order to accommodate lead frames of single in-line packages (SIP), a second recess is formed in the bottom or substrate side of the plate adjacent lead holes that are defined by a plate thickness that is slightly greater than the height of lead tines located on lead pads. In a printing operation, the bottom of the plate is moved into contact with the padded side of the substrate of a SIP, with lead tines on lead pads being located in associated lead holes and the lead frame in the second recess. Paste solder is then squeegeed over the top of the plate for printing solder onto the component and lead pads of the substrate in a single printing operation. The paste is then moved away from the substrate so that components may be placed into paste solder prior to passing the leaded substrate and components thereon through a reflow solder operation for simultaneously soldering component leads and tines to associated pads.
REFERENCES:
patent: 3402110 (1968-09-01), Scherrer
patent: 3516155 (1970-06-01), Smith
patent: 3750252 (1973-08-01), Landman
patent: 3769908 (1973-11-01), Griffin
patent: 4132341 (1979-01-01), Bratschun
IBM Tech. Dis. Bul., vol 14, #3, Aug. 1971, p. 748.
Beck Shrive P.
Bueker Richard
Cannon Russell A.
GTE Automatic Electric Laboratories Inc.
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