Method of sampling contaminants of semiconductor wafer carrier

Details Method of sampling contaminants of semiconductor wafer carrier Method of sampling contaminants of semiconductor wafer carrier

2005-08-02

2005-08-02

Kornakov, M. (Department: 1746)

Cleaning and liquid contact with solids

Processes

Hollow work, internal surface treatment

C134S021000, C134S024000, C134S034000, C134S042000, C134S902000, C073S863000, C073S863710, C073S864000, C073S864330

Reexamination Certificate

active

06923188

ABSTRACT:
A method of sampling contaminants of a semiconductor wafer carrier. The method includes placing a tool chamber in a clean room and then placing and fixing the semiconductor wafer carrier with its opening facing downward inside the tool chamber. Then the method includes using at least one nozzle to spray extraction fluid uniformly on the inner surfaces of the semiconductor wafer carrier and collecting the extraction fluid.

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patent: 5752985 (1998-05-01), Nagafune et al.
patent: 6248177 (2001-06-01), Halbmaier
patent: 6432214 (2002-08-01), Bryer et al.
patent: 6676770 (2004-01-01), Hou et al.
patent: 2002/0100495 (2002-08-01), Bexten et al.

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