Method of roughing a metallic surface of a semiconductor deposit

Details Method of roughing a metallic surface of a semiconductor deposit Method of roughing a metallic surface of a semiconductor deposit

1997-11-14

1999-09-14

Eley, Timothy V.

Abrading

Abrading process

Utilizing fluent abradant

20419232, 451 54, 451 39, B24B 100

Patent

active

059513721

ABSTRACT:
The present invention provides a method of roughing a metallic surface. In one embodiment, the method includes the steps of positioning a pressurized grit source a predetermined distance from and at an angle substantially perpendicular to the metallic surface of the object that is to be roughened, projecting grit from the pressurized grit source against the metallic surface, forming a grit impact area, which in certain embodiments may be seven inches square, on the metallic surface, and moving the pressurized grit source from the grit impact area after an amount of time that ranges from about three seconds to about eight seconds.

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