Method of rinsing and drying semiconductor wafers in a chamber w

Details Method of rinsing and drying semiconductor wafers in a chamber w Method of rinsing and drying semiconductor wafers in a chamber w

1998-03-05

1999-06-22

Warden, Jill

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 2, 134 21, 134 254, 134 255, 134 26, 134 31, 134183, 134902, 34 77, 34 78, B08B 300

Patent

active

059139811

ABSTRACT:
A method and apparatus for rinsing and drying semiconductor wafers. The apparatus includes side walls, end walls and a base. At least a portion of the wall descends relative to the base to facilitate the flow of liquid from the chamber. One embodiment of the apparatus includes a rigid side and end walls. In another embodiment of the apparatus, at least a portion of the side wall is collapsible. In yet another embodiment of the apparatus, at least a portion of the wall has a tambour configuration, facilitating bending or rolling of the wall beneath the base. The apparatus includes an assembly for injecting a rinse liquid into the chamber. The apparatus also includes an assembly for injecting a drying fluid into the chamber. The method includes placing a semiconductor wafer into the rinse/dry apparatus, directing rinse liquid over the semiconductor wafer, and lowering a side wall of the rinse/dry apparatus to remove rinse liquid therefrom.

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