Method of rinsing and drying semiconductor wafers in a chamber w

Details Method of rinsing and drying semiconductor wafers in a chamber w Method of rinsing and drying semiconductor wafers in a chamber w

1999-04-26

1999-11-16

Gulakowski, Randy

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 3, 134 21, 134 254, 134 255, 134 26, 134 31, 134183, 134902, 34 77, 34 78, B08B 300

Patent

active

059850418

ABSTRACT:
A method for rinsing and drying semiconductor wafers. The method includes placing a semiconductor wafer into a rinse/dry apparatus, directing rinse liquid over the semiconductor wafer, and lowering at least a portion of a side wall of the rinse/dry apparatus to remove rinse liquid therefrom.

REFERENCES:
patent: 5022419 (1991-06-01), Thompson et al.
patent: 5115576 (1992-05-01), Roberson, Jr. et al.
patent: 5190064 (1993-03-01), Aigo
patent: 5474616 (1995-12-01), Hayami et al.
patent: 5520744 (1996-05-01), Fujikawa et al.
patent: 5524361 (1996-06-01), Dexter et al.
patent: 5571337 (1996-11-01), Mohindra et al.
patent: 5634978 (1997-06-01), Mohindra et al.
patent: 5635053 (1997-06-01), Aoki et al.
patent: 5653045 (1997-08-01), Ferrell
patent: 5656097 (1997-08-01), Olesen et al.
patent: 5743280 (1998-04-01), Han
patent: 5913981 (1999-06-01), Florez

Affiliated with

Also associated with

Rating

Method of rinsing and drying semiconductor wafers in a chamber w does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of rinsing and drying semiconductor wafers in a chamber w, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of rinsing and drying semiconductor wafers in a chamber w will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1319117