Method of rinsing and drying semiconductor wafers in a chamber w

Details Method of rinsing and drying semiconductor wafers in a chamber w Method of rinsing and drying semiconductor wafers in a chamber w

1999-08-13

2000-12-26

Gulakowski, Randy

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 3, 134 21, 134 254, 134 255, 134 26, 134 31, 134183, 134902, 34 77, 34 78, B08B 300

Patent

active

061652776

ABSTRACT:
A method for rinsing and drying semiconductor wafers. The method includes placing a semiconductor wafer into a chamber of a rinse/dry apparatus, directing rinse liquid over the semiconductor wafer, and moving a portion of the chamber, such as a portion of a wall of the chamber, substantially vertically relative to the remainder of the chamber to remove rinse liquid therefrom. The method may also include directing a drying fluid onto a surface of the rinse liquid to facilitate drying of the rinsed semiconductor wafers as rinse liquid is being removed from the chamber.

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