Method of reworking circuit panels, and circuit panels reworked

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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Details

29846, H05G 100

Patent

active

052142507

ABSTRACT:
Disclosed is a method of reworking a circuit panel, and a reworked circuit panel structure. The method includes providing a conformal, polymeric, dielectric coating or coatings on the surface of the panel, providing conductive circuitization atop the conformal, polymeric, dielectric coating or coatings on the surface of the panel, and providing a top conformal, polymeric, dielectric coating atop the conductive circuitization layer. Also disclosed is a rerouted circuit panel having at least two surface features that are connected by a rerouted current lead. The current lead is formed of a dielectric encapsulated conductor electrically joining the two surface features. The dielectric encapsulated conductor structure includes a conformal, polymeric dielectric bottom layer adherent to a surface of the circuit board, with a provided conductor on the conformal, polymeric dielectric layer, and a conformal, polymeric dielectric layer provided atop the provided conductor. The polymeric dielectric bottom layer may include one or more layers atop one another.

REFERENCES:
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patent: 4654102 (1987-03-01), Wery et al.
patent: 4731704 (1988-03-01), Lochner
patent: 4864723 (1989-09-01), Griffith et al.
patent: 4866507 (1989-09-01), Jacobs et al.
IBM TDB, vol. 15, No. 1, Jun. 1972, Printed-Circuit Card Rework Process S. Picard.
Circuits Manufacturing, "Screen Printing Engineering Changes on PCBs" vol. 19, No. 11, pp. 22-26, Nov. 1979.
IBM TDB, vol. 20, No. 4, Sep. 1977, Reworking of Component Bearing Cards A. F. Kozik.
IBM TDB, vol. 18, No. 7, Dec. 1975, "Circuit Overlay Adapter Assembly For Circuit Changes", W. D. Saucier.

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