Method of reworking an electrical multilayer interconnect

Details Method of reworking an electrical multilayer interconnect Method of reworking an electrical multilayer interconnect

1990-06-25

1991-04-30

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 381, 204 384, C25D 502

Patent

active

050115804

ABSTRACT:
A method of reworking an electrical multilayer interconnect in which the electrical lines can be protected by an overcoat. The method includes removing a defective metallization layer from the top of an interconnect substrate, depositing an electrically conductive layer on the substrate, forming a base plating mask on the electrically conductive layer, plating a copper base into an opening in the base plating mask onto the electrically conductive layer, stripping the base plating mask, forming a pillar plating mask on top of the copper base, plating an electrically conductive metal pillar into an opening in the pillar plating mask onto the top of the copper base, stripping the plating mask, and stripping the electrically conductive layer below the stripped base plating mask. Additionally, a protective overcoat layer can be deposited on the exposed copper surfaces.

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