Method of retaining a solder mass on an article

Details Method of retaining a solder mass on an article Method of retaining a solder mass on an article

2007-03-13

2007-03-13

Paumen, Gary F. (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

C439S876000, C228S056300, C228S246000, C174S09400S, C174S263000

Reexamination Certificate

active

10509200

ABSTRACT:
A method of retaining a solder mass to a solder-bearing article is provided and includes the steps of: (a) forming a plurality of openings in the solder-bearing article; (b) disposing a length of solder mass over at least some of the plurality of openings; and forming a plurality of solder rivets along the length of the solder mass. The solder rivets serve to retain the length of solder mass to the solder-bearing article. The solder-bearing article includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.

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