Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Patent
1991-07-02
1992-04-14
Tufariello, T. M.
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
C25D 1100
Patent
active
051044943
ABSTRACT:
A low-temperature, nondestructive method of electrochemical reduction is provided for restoring solderability of oxidized electronic component leads and solderable portions of printed wiring boards. The component or circuit board is immersed in an electrolyte solution. The electrolyte is chosen to be non-reactive with the circuit board and component materials. In one embodiment, the electrolyte comprises a benign borate buffer solution. The solderable portion of the component or circuit board is connected to the cathode of an electric power source to form a first electrode. A second, inert electrode is connected to the anode of the current source and immersed in the electrolyte. Current passing between the electrodes electrochemically reduces the metallic oxides on the solderable portions of the component or circuit board. In a second embodiment, the electrolyte comprises an active reducing agent. When the solderable portion of the component or circuit board is immersed in the reducing agent, localized galvanic action causes reduction of any metallic oxides without connection to an external power source. This is particularly useful for restoring solderability of printed wiring boards having non-interconnected circuitry. Reduction of the oxides to their metallic form restores and ensures solderability of the solderable portions of the electronic component or printed wiring board.
REFERENCES:
patent: 1749549 (1930-03-01), Slepian
Anderson Dennis P.
Tench D. Morgan
McFarren John C.
Rockwell International Corp.
Tufariello T. M.
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