Method of resist stripping during semiconductor device fabricati

Details Method of resist stripping during semiconductor device fabricati Method of resist stripping during semiconductor device fabricati

1998-05-27

2000-08-22

Gulakowski, Randy

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134 12, 438725, H01L 21302

Patent

active

061055883

ABSTRACT:
A method of resist stripping for use during fabrication of semiconductor devices. A semiconductor substrate with a resist material formed thereon, such as a silicon wafer, is positioned in a sealed chamber in communication with a plasma generating source. A gaseous material which includes a reducing agent is passed through the plasma generating source to produce a plasma stream. The plasma stream is directed at the semiconductor substrate for a predetermined period of time to remove the resist material from the semiconductor substrate. A reducing environment is produced in the sealed chamber by the plasma stream, which can passivate and strip the resist material simultaneously.

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