Method of resin sealing electronic part

Details Method of resin sealing electronic part Method of resin sealing electronic part

2006-07-11

2009-12-29

Kebede, Brook (Department: 2894)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C257SE21499

Reexamination Certificate

active

07638367

ABSTRACT:
A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

REFERENCES:
patent: 7056770 (2006-06-01), Uragami et al.
patent: 2004/0048416 (2004-03-01), Takase
patent: 2006/0078246 (2006-04-01), Ashida
patent: 1503339 (2004-06-01), None
patent: 5-243301 (1993-09-01), None
patent: 2002-137250 (2002-05-01), None
patent: 2004179284 (2004-06-01), None
patent: 2004-216558 (2004-08-01), None
patent: 2004230707 (2004-08-01), None
Chinese Office Action dated Mar. 7, 2008, issued in corresponding Chinese Patent Application No. 200610107503 and English translation.

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