Fishing – trapping – and vermin destroying
Patent
1987-06-16
1988-09-06
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437211, 357 66, 357 74, 27744, 174 52PE, H01L 2308
Patent
active
047693444
ABSTRACT:
A semiconductor device and a method for manufacturing a semiconductor device of a type having a resin package and a window in the package such as a quartz glass window transparent to ultraviolet rays. A semiconductor chip is bonded onto a surface of a die pad of a lead frame. A softened resin is then extruded from the opposite surface of the die pad through gaps between the die pad and the leads with the extrusion being carried out in an inert gas atmosphere. An inner package member is thus formed surrounding the semiconductor chip. An outer package member, made of a thermosetting resin having a weight ratio of resin to filler less than that of the inner package, is molded around the chip assembly and inner package.
Matsuda Sadamu
Sakai Kunito
Takahama Takashi
Hearn Brian E.
Mitsubishi Denki & Kabushiki Kaisha
Pawlikowski Beverly Ann
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