Method of resiliently mounting an integrated circuit chip to ena

Details Method of resiliently mounting an integrated circuit chip to ena Method of resiliently mounting an integrated circuit chip to ena

1991-05-29

1992-12-08

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437219, 437224, 437902, H01L 2152, H01L 2158, H01L 2160

Patent

active

051698056

ABSTRACT:
In integrated circuit packaging, chips are bonded to one side of an intermediate wafer that is resiliently mounted at the periphery with the entire other side of the intermediate wafer being maintained in conformal thermal transfer to external heat dissipation free of any solid connection.

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