Coating processes – Immersion or partial immersion – Metal base
Patent
1995-06-07
1997-06-03
Utech, Benjamin
Coating processes
Immersion or partial immersion
Metal base
4274431, B32B 1710
Patent
active
056352530
ABSTRACT:
A replenishing solution for a cyanide-based electroless gold plating bath. The solution includes a gold(III) halide such as gold chloride, gold bromide, tetrachloroaurate (and its sodium, potassium, and ammonium salts), and tetrabromoaurate (and its sodium, potassium, and ammonium salts). The replenishing solution also may include an alkali (such as potassium hydroxide, sodium hydroxide, and ammonium hydroxide) to maintain the pH of the solution between 8 and 14. Also provided is a method of replenishing a cyanide-based electroless gold plating bath with the solution of the present invention.
REFERENCES:
patent: 3589916 (1971-06-01), McCormack
patent: 4142902 (1979-03-01), Burke et al.
patent: 4337091 (1982-06-01), El-Shazly et al.
patent: 5130168 (1992-07-01), Mathe et al.
patent: 5258062 (1993-11-01), Nakazawo et al.
D. Mahulikar, A. Pasqualoni, J. Crane, and J. Braden, "Development of a Cost Effective High Performance Metal QFP Packaging System," in Proceedings of the IEEE International Symposium on Microelectronics, pp. 405-410 (1993).
M. Nakazawa and S. Wakabayashi, "Ceramic Packages and Substrates prepared by Electroless Ni-Au Process," in Proceedings of the IEEE/CHMT Symposium, pp. 366-370 (1991).
B. Hassler, "Confired Metallized Ceramic Technology and Fabrication Using Electroless Plating," in Proceedings of the International Symposium on Microelectronics, pp. 741-748 (1986).
T. Goodman, H. Fujita, Y. Murakami, and A. Murphy, "High Speed Electrical Characterization and Simulation of Pin Grid Array Package," in Proceedings of the IEEE/CHMT Japan International Electronics Manufacturing Technology Symposium, pp. 303-307 (1993).
G. Ganu and S. Mahapatra, "Electroless Gold Deposition for Electronic Industry," in Journal of Sci. & Ind. Res., vol. 46, pp. 154-161 (1987).
H. Ali and I. Christie, "A Review of Electroless Gold Deposition Processes," in Gold Bull., vol. 17, pp. 118-127 (1984).
Y. Okinaka and C. Wolowodiuk, "Electroless Gold Deposition: Replenishment of Bath Constituents," in Plating, vol. 58, pp. 1080-1084 (1971).
F. Simon, "Deposition of Gold Without External Current Source," in Gold Bulletin, vol. 26, pp. 14-26 (1993).
Canaperi Donald F.
Jagannathan Rangarajan
Krishnan Mahadevaiyer
International Business Machines - Corporation
Utech Benjamin
LandOfFree
Method of replenishing electroless gold plating baths does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of replenishing electroless gold plating baths, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of replenishing electroless gold plating baths will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-389840