Metal fusion bonding – Process – With condition responsive – program – or timing control
Reexamination Certificate
2003-01-08
2009-12-08
Ward, Jessica L. (Department: 1793)
Metal fusion bonding
Process
With condition responsive, program, or timing control
C228S103000, C228S256000, C228S260000, C228S008000, C228S011000, C075S386000, C420S560000
Reexamination Certificate
active
07628308
ABSTRACT:
The rate of decrease of an oxidation suppressing element in a solder bath is measured during a soldering operation. Soldering is then carried out while replenishing the solder bath is then replenished during soldering so as to maintain the surface level of molten solder in the bath with a replenishment solder alloy which supplies the oxidation suppressing element to the solder bath at at least the rate at which the oxidation suppressing element is consumed during soldering. When the oxidation suppressing element is P, the concentration of P in the replenishment solder alloy is preferably 60-100 ppm.
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Eguchi Norihisa
Munekata Osamu
Nogami Hirofumi
Ojima Masayuki
Suzuki Haruo
Gamino Carlos
Matushita Electric Industrial Co. Ltd.
Senju Metal Industry Co. Ltd.
Tobias Michael
Ward Jessica L.
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