Method of removing unnecessary matter from semiconductor...

Details Method of removing unnecessary matter from semiconductor... Method of removing unnecessary matter from semiconductor...

2007-09-04

2007-09-04

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including contaminant removal or mitigation

C438S106000, C438S455000, C257SE21499

Reexamination Certificate

active

11029351

ABSTRACT:
In an unnecessary matter removal method of joining a separation tape onto a semiconductor wafer and, then, separating the separation tape from the semiconductor wafer, thereby separating an unnecessary matter on the semiconductor wafer together with the separation tape, the separation tape is separated from the semiconductor wafer in such a manner that an edge member is brought into contact with the separation tape joined to the semiconductor wafer, and a tip end of the edge member is pressed to the semiconductor wafer at a separation completion end portion where the unnecessary matter is separated from the wafer.

REFERENCES:
patent: 5961768 (1999-10-01), Tsujimoto
patent: 2005/0061425 (2005-03-01), Yamamoto
patent: 2006/0089004 (2006-04-01), Yamamoto
patent: 2002-124494 (2002-04-01), None

Affiliated with

Also associated with

Rating

Method of removing unnecessary matter from semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of removing unnecessary matter from semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of removing unnecessary matter from semiconductor... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3793332