Method of removing sputter deposition from components of vacuum

Details Method of removing sputter deposition from components of vacuum Method of removing sputter deposition from components of vacuum

1995-06-16

1997-08-26

Warden, Jill

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134 2, 134 3, 134 7, 134 28, 134 29, 134 41, 216108, B08B 312, G23G 102

Patent

active

056606400

ABSTRACT:
A method for removing deposited material from vacuum deposition equipment is disclosed. The method utilizes a low temperature bath, between 40-50 degrees F., to strip sputter depositions, followed by an acid etch step using a low concentration of hydrofluoride acid to remove trace contamination from the surface. Following removal of deposited material, surface texturing of the components is provided.

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patent: 3553015 (1971-01-01), Dohogne
patent: 3788914 (1974-01-01), Gumbelevicius
patent: 5290362 (1994-03-01), Sue
patent: 5308400 (1994-05-01), Chen
patent: 5464031 (1995-11-01), Buley et al.
patent: 5489557 (1996-02-01), Jolley
patent: 5509971 (1996-04-01), Kirschner

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