Method of removing resinous materials adhering to injection head

Details Method of removing resinous materials adhering to injection head Method of removing resinous materials adhering to injection head

1992-03-25

1993-06-08

Heitbrink, Jill L.

Plastic and nonmetallic article shaping or treating: processes

With step of cleaning, polishing, or preconditioning...

264161, 2643286, B29C 4527

Patent

active

052176614

ABSTRACT:
A method of and an apparatus for automatically removing deposits such as resin materials adhering to an injection head. According to the method, a liquid reactive resin is poured into a molding cavity internally defined in a mold assembly from an injection head through an injection hole. Then, an automatic cutting device is displaced toward the injection head separated from the injection hole after the reactive resin poured into the molding cavity has been hardened. Thereafter, the automatic cutting device is activated to cut unnecessary hardened resin materials adhering to the injection head. Thus, the hardened resin materials can reliably be removed without subjecting the injection head to damage. It is also possible to effectively prevent the reactive resin from adhering to the injection head when the next molding process is carried out. Further, since a resin material removing process is automatically performed, any burden imposed on an operator can be lightened and the entire molding process can efficiently be carried out.

REFERENCES:
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patent: 3814780 (1974-06-01), Woodhall
patent: 4655274 (1987-04-01), Dannoura
patent: 4820467 (1989-04-01), Ehrler et al.
Lee, Ly James, "Impingement Mixing in Reaction Injection Molding", Polymer Engineering and Science, Sep. 1980, vol. 20, No. 13, pp. 868-874.

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