Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2006-06-20
2006-06-20
Nguyen, Tuan H. (Department: 2813)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S725000
Reexamination Certificate
active
07064079
ABSTRACT:
A method of removing polymer adhered to a sidewall of an etched metal layer formed on a substrate, includes (a) dissolving the polymer by providing chemicals onto a surface of the substrate, and (b) rinsing the chemicals out of the substrate by providing pure water onto a surface of the substrate, wherein at least a part of the step (a) is carried out in oxidation atmosphere.
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Kawaguchi Hidehiko
Ohno Hiroki
Sonoda Hiroyuki
Tanaka Morimitsu
NEC Electronics Corporation
Nguyen Tuan H.
Young & Thompson
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