Etching a substrate: processes – Nongaseous phase etching of substrate – Etching using radiation
Patent
1995-07-07
1997-10-28
Dang, Thi
Etching a substrate: processes
Nongaseous phase etching of substrate
Etching using radiation
216 83, 252 792, 252 791, 134 1, G03C 1100
Patent
active
056814879
ABSTRACT:
The present invention provides a method of removing a photoresist film, which exhibits the high ability to remove photoresist and excellent safety and handling properties such as workability, In the removing method, the photoresist film is removed by chemical decomposition in an inorganic aqueous solution under ultraviolet-light irradiation. The inorganic aqueous solution is an aqueous solution of peroxomonosulfate or an aqueous solution containing 4.5 to 36 wt % of sulfuric acid and 0.05 to 0.8 wt % of hydrogen peroxide.
REFERENCES:
patent: 3787239 (1974-01-01), Schroeder et al.
patent: 3900337 (1975-08-01), Beck et al.
patent: 3988254 (1976-10-01), Mori
patent: 4963342 (1990-10-01), Lapham et al.
patent: 5068040 (1991-11-01), Jackson
patent: 5269850 (1993-12-01), Jackson
patent: 5464480 (1995-11-01), Matthews
Iwasaki Chisato
Kasama Yasuhiko
Ohmi Tadahiro
Seki Hitoshi
Sekiya Akane
Bever Patrick T.
Dang Thi
Frontec Incorporated
Ohmi Tadahiro
Shoup Guy W.
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