Method of removing particles from substrate surfaces

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

4272555, 427264, 427265, 427294, 427348, 427402, B05D 306

Patent

active

049960784

ABSTRACT:
A method is described for the vacuum-coating of substrates, such as glass plates, foils, plastics substrates for optical discs etc., in which the substrates are introduced into a vacuum-coating arrangement and are vacuum-coated in accordance with a PVD (physical vapour-deposition) process such as for example cathode sputtering or vapour-deposition. In order to avoid pinholes in the coating the method is carried out in three steps, namely a first PVD step, in which the substrates and any particles adhering thereto are coated; a particle-displacement step in which the coated particles are displaced from their initial positions on the substrate; and an additional, second PVD step, in which the substrates are coated a second time to cover the defects formed in the coating by adhering particles in the first coating step.

REFERENCES:
patent: 4683149 (1987-07-01), Suzuki et al.

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