Method of removing palladium

Details Method of removing palladium Method of removing palladium

2006-08-01

2006-08-01

Nazario-Gonzalez, Porfirio (Department: 1621)

Organic compounds -- part of the class 532-570 series

Organic compounds

Heavy metal containing

C502S060000, C423S022000

Reexamination Certificate

active

07084287

ABSTRACT:
There is disclosed a method for removing palladium, which method is characterized by contacting a solution containing a palladium complex containing a phosphorus-type ligand in an organic solvent with a layered clay compound or a zeolite having a pore diameter of 0.6 to 2 nm.

REFERENCES:
patent: 5362850 (1994-11-01), Cooper et al.
patent: 5491250 (1996-02-01), Stark et al.
patent: 2005/0181931 (2005-08-01), Mouri et al.
patent: 3-66725 (1991-03-01), None
patent: 7-74073 (1995-03-01), None
patent: 2002-194450 (2002-07-01), None
patent: 2003-246862 (2003-09-01), None
patent: 2003-292878 (2003-10-01), None
patent: 2003-299905 (2003-10-01), None
patent: 2004-59444 (2004-02-01), None
Chen, Cheng-yi et al., “Practical Asymmetric Synthesis of a Potent Cathespin K Inhibitor. Efficient Palladium Removal Following Suzuki Coupling”,J. Org. Chem. 2003, vol. 68, pp. 2633-2638.
Cooke, Jason W.B. et al., “Process Research and Development of a Dihydropyrimidine Dehydrogenase Inactivator: Large Scale Preparation of Eniluracil Using a Sonogashira Coupling”,Organic Process Research&Development, 2001, vol. 5, pp. 383-386.
Ishihara, Kazuaki et al., “Removal of Palladium(II) from Aqueous and Organic Solutions by Polystyrene-bound Trimercaptotriazine”,Chemistry Letters, 2000, pp. 1218-1219.

Affiliated with

Also associated with

Rating

Method of removing palladium does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of removing palladium, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of removing palladium will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3617859