Method of removing outer protective layer from edible materials

Details Method of removing outer protective layer from edible materials Method of removing outer protective layer from edible materials

1987-11-30

1989-06-13

Yeung, George

Food or edible material: processes, compositions, and products

Direct application of electrical or wave energy to food...

17 62, 99451, 426482, A23L 1212

Patent

active

048391816

ABSTRACT:
Skin is removed from an edible material by passing the edible material through a skin removal zone of an ablative removal apparatus. In the skin removal zone, skin is ablatively removed by the action of a continuous wave carbon dioxide laser beam which rapidly traverses the skin removal zone in a direction substantially transverse to the edible material movement. The edible material may be skinned regardless of whether it is fresh, frozen, thawed, or cooked. Skin vaporized by the laser light beam generates a gaseous plume which is removed from the skin removal zone by causing a current of air to traverse that zone.

REFERENCES:
patent: 4358467 (1982-11-01), Patel

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