Method of removing organic materials from substrates

Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C134S001300, C134S034000, C134S038000

Reexamination Certificate

active

08066819

ABSTRACT:
Water-free, gaseous sulfur trioxide is used as an agent to remove various organic coatings, films, layers and residues from the surface of a substrate when used in conjunction with certain other physical and chemical treatments applied at the appropriate time during the process.

REFERENCES:
patent: 3893869 (1975-07-01), Mayer et al.
patent: 4179071 (1979-12-01), Kozacka
patent: 4363673 (1982-12-01), Settineri et al.
patent: 4455175 (1984-06-01), Settineri et al.
patent: 4536222 (1985-08-01), Settineri et al.
patent: 4669544 (1987-06-01), Nimerick
patent: 4778536 (1988-10-01), Grebinski
patent: 4915912 (1990-04-01), Walles et al.
patent: 5024968 (1991-06-01), Engelsberg
patent: 5030399 (1991-07-01), Walles et al.
patent: 5037506 (1991-08-01), Gupta et al.
patent: 5114834 (1992-05-01), Nachshon
patent: 5158100 (1992-10-01), Tanaka et al.
patent: 5227001 (1993-07-01), Tamaki et al.
patent: 5531857 (1996-07-01), Engelsberg et al.
patent: 5643472 (1997-07-01), Engelsberg et al.
patent: 5763016 (1998-06-01), Levinson et al.
patent: 5952157 (1999-09-01), Kato et al.
patent: WO9507152 (1995-03-01), None
patent: WO9717164 (1997-05-01), None
Stanley Wolf and Richard N. Tauber, “Silicon Processing For The VLSI Era”,Process Technology, vol. 1 (1986), p. 564.
“Choose the Right Process to Strip Your Photoresist”,Semiconductor International, Feb. 1990, pp. 83-87.
“New Concerns in Dry Oxygen Ashing”,Semiconductor International, Mar. 1996, p. 44; and.
“What's Driving Resists Dry Stripping?”,Semiconductor International, Nov. 1994, pp. 61-64.
Christina M. Cline, “Emerging Technology; Emerging Markets”,Precision Cleaning, Oct. 1996, pp. 11-19.
Ruth DeJule, “Managing Etch and Implant Residue”,Semiconductor International, Aug. 1997, pp. 56-63.
Hawley's Condensed Chemical Dictionary, p. 28, 1993.
Egelsberg, “Laser Assisted Cleaning Proves Promising”,Precision Cleaning, 1994.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of removing organic materials from substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of removing organic materials from substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of removing organic materials from substrates will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4303465

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.