Method of removing optical device

Details Method of removing optical device Method of removing optical device

2005-03-15

2005-03-15

Vo, Peter (Department: 3729)

Metal working

Method of mechanical manufacture

Disassembling

C029S426500, C029S764000, C029S840000, C029S841000, C156S345420, C438S065000

Reexamination Certificate

active

06865790

ABSTRACT:
A method of removing an optical device contained within a device package from a circuit board, wherein the device package is secured to the circuit board using an adhesive pad. The method includes peeling a portion of the adhesive pad away from the circuit board, inserting an optical removal tool between the optical device and the circuit board, wherein the optical removal tool has a pair of fork portions and a cavity positioned between the fork portions, and the fork portions straddle one or more leads on the optical device during the inserting step, and prying the remainder of the adhesive pad away from the circuit board using the optical device removal tool.

REFERENCES:
patent: 3443297 (1969-05-01), Lusby, Jr.
patent: 4034202 (1977-07-01), Vandermark
patent: 4896019 (1990-01-01), Hyun
patent: 4961256 (1990-10-01), Faillace
patent: 5502887 (1996-04-01), Gonzales
patent: 6108901 (2000-08-01), Kossor
patent: 6215295 (2001-04-01), Smith, III

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