Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate
2006-12-28
2008-08-12
Deo, Duy-Vu N (Department: 1792)
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
C438S746000, C134S001000, C134S001300
Reexamination Certificate
active
07410909
ABSTRACT:
A method of removing an ion implanted photoresist comprises performing first cleaning a semiconductor substrate having the ion implanted photoresist using hot deionized water to which a megasonic process is applied, first rinsing the semiconductor substrate using cold deionized water, drying the semiconductor substrate, removing the ion implanted photoresist, and second cleaning the semiconductor wafer using an SPM solution.
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Han Ji Hye
Kim Woo Jin
Moon Ok Min
Oh Kee Joon
Park Ji Yong
Deo Duy-Vu N
Hynix / Semiconductor Inc.
Marshall & Gerstein & Borun LLP
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