Method of removing ion implanted photoresist

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching

Reexamination Certificate

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Details

C438S746000, C134S001000, C134S001300

Reexamination Certificate

active

07410909

ABSTRACT:
A method of removing an ion implanted photoresist comprises performing first cleaning a semiconductor substrate having the ion implanted photoresist using hot deionized water to which a megasonic process is applied, first rinsing the semiconductor substrate using cold deionized water, drying the semiconductor substrate, removing the ion implanted photoresist, and second cleaning the semiconductor wafer using an SPM solution.

REFERENCES:
patent: 5895272 (1999-04-01), Li
patent: 6313078 (2001-11-01), Tsuboi
patent: 6352936 (2002-03-01), Jehoul et al.
patent: 6372413 (2002-04-01), Ema et al.
patent: 6622738 (2003-09-01), Scovell
patent: 6683008 (2004-01-01), Cotte et al.
patent: 6875706 (2005-04-01), Lee et al.
patent: 2005/0227482 (2005-10-01), Korzenski et al.
patent: 10-1999-0070021 (1999-09-01), None

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