Method of removing integrated circuit chip package and...

Metal working – Method of mechanical manufacture – Disassembling

Reexamination Certificate

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Details

C029S426400, C029S762000, C029S764000, C438S004000, C228S191000, C228S119000

Reexamination Certificate

active

07469457

ABSTRACT:
A detachment jig is placed on a printed circuit board. Advancement of an inclined surface of the detachment jig is received on a solder bump of solid state disposed between the printed circuit board and an integrated circuit chip package. The solder bump melts to remove restraint to the advancement of the inclined surface, so that the inclined surface advances into a space between the printed circuit board and the chip package in response to the melt of the solder bump. A force to lift the chip package in the direction perpendicular to the surface of the printed circuit board acts on the chip package after the solder bump has completely melted down. Detachment of an electrically conductive pad is thus reliably prevented on the printed circuit board. The chip package can solely be removed without inducing detachment of the electrically conductive pad on the printed circuit board.

REFERENCES:
patent: 3579795 (1971-05-01), Burman
patent: 3632973 (1972-01-01), O'Keefe
patent: 3673384 (1972-06-01), Burman et al.
patent: 3804320 (1974-04-01), Vandermark
patent: 3895214 (1975-07-01), Winter
patent: 4034202 (1977-07-01), Vandermark
patent: 4274576 (1981-06-01), Shariff
patent: 4767047 (1988-08-01), Todd et al.
patent: 4799617 (1989-01-01), Friedman
patent: 4828162 (1989-05-01), Donner et al.
patent: 5054681 (1991-10-01), Kim
patent: 5216803 (1993-06-01), Nolan et al.
patent: 5263620 (1993-11-01), Hernandez et al.
patent: 5355580 (1994-10-01), Tsukada
patent: 5842261 (1998-12-01), Ortiz
patent: 6119325 (2000-09-01), Black et al.
patent: 6156150 (2000-12-01), Nishida
patent: 7004371 (2006-02-01), Chin
patent: 2004/0111876 (2004-06-01), Cheng
patent: 2005/0257369 (2005-11-01), Daily et al.
patent: 8-274460 (1996-10-01), None
patent: 10056258 (1998-02-01), None
patent: 2001-237539 (2001-08-01), None
patent: 2002-343838 (2002-11-01), None
patent: 2006041375 (2006-02-01), None
patent: 2006147888 (2006-06-01), None
English translation of JP 08-274460.
English translation of JP 2002-343838.

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