Metal working – Method of mechanical manufacture – Disassembling
Reexamination Certificate
2005-02-22
2008-12-30
Omgba, Essama (Department: 3726)
Metal working
Method of mechanical manufacture
Disassembling
C029S426400, C029S762000, C029S764000, C438S004000, C228S191000, C228S119000
Reexamination Certificate
active
07469457
ABSTRACT:
A detachment jig is placed on a printed circuit board. Advancement of an inclined surface of the detachment jig is received on a solder bump of solid state disposed between the printed circuit board and an integrated circuit chip package. The solder bump melts to remove restraint to the advancement of the inclined surface, so that the inclined surface advances into a space between the printed circuit board and the chip package in response to the melt of the solder bump. A force to lift the chip package in the direction perpendicular to the surface of the printed circuit board acts on the chip package after the solder bump has completely melted down. Detachment of an electrically conductive pad is thus reliably prevented on the printed circuit board. The chip package can solely be removed without inducing detachment of the electrically conductive pad on the printed circuit board.
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English translation of JP 08-274460.
English translation of JP 2002-343838.
Ishikawa Tetsuji
Kobayashi Masakazu
Saitou Osamu
Terauchi Hideaki
Fujitsu Limited
Omgba Essama
Westerman, Hattori, Daniels & Adrian , LLP.
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