Method of removing deposits of tin, lead or tin/lead alloys from

Details Method of removing deposits of tin, lead or tin/lead alloys from Method of removing deposits of tin, lead or tin/lead alloys from

1989-12-15

1990-10-23

Pal, Asok

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 41, 252 794, C23G 102, C09K 1306

Patent

active

049649205

ABSTRACT:
A composition for removing a layer of tin, lead or tin/lead alloy from a copper substrate such as a printed circuit board comprises an aqueous solution of nitric acid and ferric acid and also contains anthranilic acid to inhibit the degree of attack on the copper substrate. A surfactant, such as a mixture of cocoamine and an ethoxylated fatty alcohol or a mixture of a phosphate ester and an ethylene oxide/propylene oxide copolymer, may also be present to improve the brightness of the remaining copper.

REFERENCES:
patent: 4306933 (1981-12-01), Da Foute
patent: 4374744 (1983-02-01), Kawanabe
patent: 4713144 (1987-12-01), Schiller

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