Method of removing damaged crystal regions from silicon wafers

Details Method of removing damaged crystal regions from silicon wafers Method of removing damaged crystal regions from silicon wafers

1996-04-08

1999-06-15

Codd, Bernard

Electric heating

Metal heating

For bonding with pressure

216 99, 438691, 438747, 438749, 134 13, 134 3, B44C 122

Patent

active

059118890

ABSTRACT:
A method is provided to remove crystal regions from silicon wafers which are damaged as a consequence of mechanical machining of the silicon wafers. The silicon wafers are pretreated with an aqueous solution containing hydrogen fluoride. Then the wafers are etched in an aqueous solution exposed to ultrasound and containing alkali metal hydroxide at temperatures from 55.degree. C. to 95.degree. C.

REFERENCES:
patent: 3224904 (1965-12-01), Klein
patent: 3518132 (1970-06-01), Glendinning
patent: 3998653 (1976-12-01), Anthony et al.
patent: 4156619 (1979-05-01), Griesshammer
patent: 4261791 (1981-04-01), Schwartzman
patent: 4555302 (1985-11-01), Urbanik
patent: 5092937 (1992-03-01), Ogura et al.
patent: 5129955 (1992-07-01), Tanaka
patent: 5229334 (1993-07-01), Kato
patent: 5565060 (1996-10-01), Austin et al.
patent: 5635463 (1997-06-01), Muraoka
patent: 5679171 (1997-10-01), Saga et al.
L.D. Dyer, G.J. Grant, C.M. Tripton, A.E. Stephens, Electro-Chem. Soc. Symp. Ser. pp. 296, Jun. 1989, "A Comparison of Silicon Wafer Etching by Kolf and Acid Solutions".
Journal of Electrochemicals Society, Jan. 1, 1989, pp. 296-297 XP 000575047 Dyer et al. "A comparison of silicon water etching by KOH and acid solutions".
English Abstract for DE-A-3328639.
English Abstract for DE 2237825.
I.B.M. Technical Disclosure Bulletin, "Etching with Combined High and Low Frequency Application" Butora et al. p. 667. Nov. 1968.

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