Cleaning and liquid contact with solids – Processes – Including melting
Patent
1995-06-07
1997-03-18
El-Arini, Zeinab
Cleaning and liquid contact with solids
Processes
Including melting
134 19, 134 21, 134 26, B08B 304, B08B 504
Patent
active
056118660
ABSTRACT:
A method of removing B.sub.2 O.sub.3 encapsulant from a structure which includes providing a structure having a melting temperature and having a layer of B.sub.2 O.sub.3 thereon. This structure with the layer of B.sub.2 O.sub.3 thereon is placed in a chamber at a temperature in excess of 400.degree. C. and below the melting temperature of the structure and at some pressure and the pressure in the chamber is decreased, preferably to about -14.7 psig, until the B.sub.2 O.sub.3 foams. Then the temperature in the chamber is lowered to below 400.degree. C. and preferably to about ambient temperature external of the chamber. The structure with the B.sub.2 O.sub.3 thereon is washed in an alcohol, preferably one of methanol and isopropanol, after the B.sub.2 O.sub.3 has foamed and the structure is then washed with the B.sub.2 O.sub.3 thereon after the B.sub.2 O.sub.3 has foamed in a liquid non-reactive with the structure to remove the B.sub.2 O.sub.3 from the structure, preferably water.
REFERENCES:
patent: 4589898 (1986-05-01), Beaver
patent: 4773852 (1988-09-01), Tanji et al.
Cantor Jay M.
Donaldson Richard L.
El-Arini Zeinab
Grossman Rene E.
Texas Instruments Incorporated
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