Method of removing a permanent photoimagable film from a printed

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...

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134 29, 134 38, B08B 308

Patent

active

053042522

ABSTRACT:
A method to remove permanent photoimagable solder mask simultaneously from the insulating laminate and conductive metal traces of a printed circuit board comprising the steps of heating a photoimagable solder mask removing solution comprised of an aqueous alkaline solution, an organic penetrating and softening agent and a tarnish and corrosion inhibitor, contacting the solution with the permanent photoimagable solder mask on the printed circuit board, allowing the permanent photoimagable solder mask to soften, and removing the photoimagable solder mask removing solution and softened permanent photoimagable solder mask simultaneously from the insulating laminate and conductive metal traces of the circuit board by rinsing the board with water.

REFERENCES:
patent: 2877188 (1959-03-01), Liddell
patent: 3796602 (1974-03-01), Briney et al.
patent: 4382008 (1983-05-01), Boreland et al.
patent: 4428871 (1984-01-01), Ward et al.
patent: 4592787 (1986-06-01), Johnson
patent: 4686059 (1987-08-01), Payerle
patent: 4770713 (1988-09-01), Ward

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