Method of removing a component from a substrate

Details Method of removing a component from a substrate Method of removing a component from a substrate

1997-01-06

1998-11-17

Graybill, David

Semiconductor device manufacturing: process

Repair or restoration

438977, 29264, 29762, 29764, H01L 2158, H01L 2168

Patent

active

058375562

ABSTRACT:
A method of removing a component bonded to a substrate utilizes a fixture having a bore therethrough which is aligned with a bore in the substrate. A screw is advanced in the bore in the fixture to cause a push pin to contact the component and force the component away from the substrate.

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