Method of reinforcing a conductive base pattern by electroplatin

Details Method of reinforcing a conductive base pattern by electroplatin Method of reinforcing a conductive base pattern by electroplatin

1978-04-13

1979-11-20

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 38B, 204192SP, C25D 502, C25D 712

Patent

active

041750101

ABSTRACT:
A method of manufacturing a device in which a conductive base pattern is formed on a substrate and is reinforced by electroplating so as to obtain a conductor pattern, characterized in that at least a surface layer of the substrate consists of an electrically insulating material on which an auxiliary layer is provided having a sheet resistance between 10.sup.12 and 10.sup.17 ohms per square, after which the base pattern is formed on the last-mentioned layer.

REFERENCES:
patent: 3737380 (1973-06-01), Bachmeier
patent: 3776820 (1973-12-01), Johnson et al.
patent: 3935083 (1976-01-01), Tomozawa

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