Method of registrably aligning fabricated wafers preceding bondi

Details Method of registrably aligning fabricated wafers preceding bondi Method of registrably aligning fabricated wafers preceding bondi

1998-12-28

2000-07-11

Ryan, Patrick

Metal fusion bonding

Process

With clamping or holding

2281231, 2282341, 414935, 414936, B23K 3102, B23K 522, B65G 4907

Patent

active

060859679

ABSTRACT:
A method of registrably aligning wafers prior to bonding uses an assembly jig having a plurality of upstanding aligning elements each of which is arranged to registrably align with one of a predetermined number of locating features of the wafers. The locating features of the wafers are arranged about a corresponding upstanding aligning element of the jig prior to bonding the wafers.

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